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Technology development map |
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| Item | KINGTON | ||||||
| Mass Production | Small volume | Prototype | |||||
| Material | FR4 | Normal Tg | S1141 KB6160 | ||||
| Middle Tg | S1000H(HDI、Multi layer) | ||||||
| High Tg | S1000-2M、IT180A(Heavy copper,Multi layer) | ||||||
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Halogen
free
|
Middle Tg | S1150G | |||||
| High Tg | S1165 | ||||||
| Ceramic filled high frequency | Rogers4003/4350/Arlon25N/25FR/RF-35/RF60/TLY-5 | ||||||
| PTFE | high frequency |
Rogers Series, Arlon Series,Taconic Series
High speed:TU872,Panasonic M4, M6
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| Special PrePreg | LOW Prepreg:Arlon 49N | ||||||
| ceramics: Rogers4450、Arlon25FR | |||||||
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PTFE Prepreg:Arlon6700、
Taconic FR-27
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| Rigid PI | Arlon85N、Shengyi、SH260 | ||||||
| Metal core | China brand aluminum core/ copper core | ||||||
| ceramics core | alumina ceramics | ||||||
| Layer count | FR4 Series | 26 | 32 | 60 | |||
| Rigid-flex/(flex) | 14(4) | 16(4) | 20(10) | ||||
|
high frequency
mixture pressing
|
20 | 30 | 40 | ||||
| Pure PTFE | 4 | 8 | 12 | ||||
| Metal core | 4 | 8 | 12 | ||||
|
Trace/
Spacing
|
Inner(mil) |
0.5OZ Base Copper: 3/3
1.0OZ Base Copper: 4/4
2.0OZ Base Copper: 5/6
3.0OZ Base Copper: 7/9
4.0OZ Base Copper: 8/12
5.0OZ Base Copper: 10/15
6.0OZ Base Copper: 12/18
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| Outer(mil) |
1/3OZ Base Copper: 3/3
0.5OZ Base Copper: 4/4
1.0OZ Base Copper: 5/5
2.0OZ Base Copper: 6/8
3.0OZ Base Copper: 7/10
4.0OZ Base Copper: 8/13
5.0OZ Base Copper: 10/16
6.0OZ Base Copper: 12/18
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| Item | KINGTON | ||||||
| Mass Production | Small volume | Prototype | |||||
| Trace Tolerance | >5.0 mil | ±20% | ±20% | ±1.0mil | |||
| ≤ 5.0 mil | ±1.0mil | ±1.0mil | ±1.0mil | ||||
| Copper | Inner (OZ) | 6 | 15 | 15 | |||
| Outer (OZ) | 6 | 15 | 18 | ||||
| Hole | Laser drill (mil) | 4 | 3 | 3 | |||
| Min. mechanical drill bit (mm) | 0.15 | 0.15 | 0.15 | ||||
| Max. mechanical drill bit(mm) | 6.5 | 6.5 | 6.5 | ||||
|
Min. Half PTH hole
(Finished size: mm)
|
0.6 | 0.5 | 0.4 | ||||
| Tolerance for hole | Normal | ±0.10 | ±0.075 | ±0.075 | |||
| Press fit | ±0.05 | ±0.05 | ±0.05 | ||||
| Controlling drill tolerance(mm) | ±0.10 | ±0.05 | ±0.05 | ||||
| Min. spacing between via(different net):mm | 0.40 | 0.35 | 0.30 | ||||
| Min. spacing between via(same net):mm | 0.2 | 0.2 | 0.2 | ||||
| Min. spacing between component hole(mm) | 0.80 | 0.70 | 0.70 | ||||
| Min. spacing between via to feature(inner layer):mil | 9 | 8 | 7 | ||||
| Min. spacing between component hole to feature(inner layer):mil | 11 | 10 | 9 | ||||
| Item | KINGTON | ||||||
| Mass Production | Small volume | Prototype | |||||
|
Ring
(mil)
|
Via | 4 | 3 | 3 | |||
| Component hole | 8 | 6 | 6 | ||||
| Soldermask Jam mil | IC Spacing(Green S/M) | 8 | 7 | 7 | |||
| IC Spacing(Other color) | 8 | 8 | 7 | ||||
| Tolerance for board thickness | >1.0 mm | ±10% | ±10% | ±8% | |||
| ≤ 1.0 mm | ±0.1 | ±0.1 | ±0.1 | ||||
| Board thickness(mm) | 0.4-8 | 0.3-10 | 0.3-10 | ||||
| Aspect Ratio(Board thickness: via) | 12:01 | 13:01 | 14:01 | ||||
| Drill bit size for via plugging (Plug soldermask):mm | 0.25-0.5 | 0.20-0.5 | 0.15-0.6 | ||||
| Drill bit size for Blind Burried via or Via in PAD(Plug resin):mm | 0.25-0.5 | 0.20-0.5 | 0.10-0.6 | ||||
| Production Panel(mm) | 600×600 | 600×600 | 600×900 | ||||
| Twist | ≤0.75% | ≤0.75% | ≤0.5% | ||||
| Impedance | >5.0mil | ±10% | ±8% | ±8% | |||
| ≤ 5.0mil | ±10% | ±10% | ±10% | ||||
| Outline | Outline tolerance (mm) | ±0.15 | ±0.10 | ±0.10 | |||
| V-CUT tolerance(mm) | ±0.15 | ±0.10 | ±0.10 | ||||
| Slot tolerance(mm) | ±0.15 | ±0.10 | ±0.10 | ||||
| Cotrolling depth routing tolerance(mm) | ±0.15 | ±0.10 | ±0.10 | ||||
| Bevel angle (°) | 20 °、30 °、45 °、60 ° | ||||||
| Finished Surface | ENIG | Ni (um) | 2.0-5.0 | 2.0-5.0 | 2.0-5.0 | ||
| Au(uinch) | 1-3 | 3-5 | 6-8 | ||||
| Hard Au(Au Thickness) | Normal Finger(um) | 0.4 | 0.8 | 1.2 | |||
| Selective hard Au(um) | 0.4 | 0.8 | 2.0 | ||||
| Immersion Tin |
Tin thickness
(um)
|
0.8-1.2 | |||||
| Immersion Silver |
Silver thickness
(uinch)
|
6-10 | |||||
| OSP |
OSP
(um)
|
0.2-0.5 | |||||
| HASL(um) | 2.0-40 | ||||||
| HASL Lead Free(um) | 2.0-40 | ||||||
| Item | KINGTON | ||||||
| Mass Production | Small volume | Prototype | |||||
| Rigid-flex | Flex board layer count | 2-4 | 6-8 | 10-12 | |||
| Flex board copper(OZ) | 0.5 | 1.0 | 1.0 | ||||
|
Flex board dielectric
thickness(um)
|
Adhensive Free 25 | Adhensive Free 25 | Adhensive 65 | ||||
| Flex board type | PTH | PTH | PTH | ||||
| Flex board width(mm) | ≥15 | ≥10 | ≥5 | ||||
| Production panel(mm) | 254×400 | 254×500 | 457 ×609 | ||||
| Spacing between via to rigid-flex edge(mm) | ≥1.5 | ≥1.0 | ≥0.8 | ||||
| Spacing between component hole to rigid-flex edge(mm) | ≥2.0 | ≥1.5 | ≥1.0 | ||||
| Normal stack up | Mass Production | Small volume | Prototype | ||||
| Flex board on outside | Mass Production | Small volume | Prototype | ||||
| Aluminum core rigid-flex | Mass Production | Small volume | Prototype | ||||
| HDI Rigid-flex | Mass Production | Small volume | Prototype | ||||
| HDI | Layer count | 12 | 16 | 24 | |||
| Finished copper(OZ) | ≤ 1.0 | ≤ 1.0 | ≤ 1.0 | ||||
| Trace/Spacing(mil) | 3/3 | 3/3 | 2.0/2.0 | ||||
| Thickness(mm) | 0.4-3.0 | 0.4-3.0 | 0.4-3.0 | ||||
| Production panel(mm) | 457×609 | 457×609 | 457×609 | ||||
| Via type | anylayer | 2十N十2 | 3十N十3 | 4十N十4 | |||
| Stacked via | 2十N十2 | 2十N十2 | 3十N十3 | ||||
| Special Technology | CAPS/RESISTOR inside | NA | NA | Prototype | |||
| Back drill | Mass Production | Small volume | Prototype | ||||
| Metal core | Mass Production | Small volume | Prototype | ||||
| Heavy Blind&Burried via | Mass Production | Small volume | Prototype | ||||
| Countersunk slot | Mass Production | Small volume | Prototype | ||||
| Via in PAD | Mass Production | Small volume | Prototype | ||||
| Half PTH Hole | Mass Production | Small volume | Prototype | ||||
| Mixture pressing | Mass Production | Small volume | Prototype | ||||